At the 2026 International Symposium on Circuits and Systems (ISCAS 2026) in Shanghai on Monday, He Tingbo, Huawei’s board member and head of its semiconductor business, said the company would launch a new Kirin smartphone chip this autumn that uses logic folding technology for the first time. The technology moves beyond conventional single-layer chip layouts by stacking logic structures into a dual-layer design, which can improve transistor density and energy efficiency, according to Huawei. The chip is expected to debut in Huawei’s Mate 90 smartphone series in September and compete with Apple’s iPhone 18 series.
The Tau (τ) Scaling Law presented at the ISCAS 2026 today was also referred to as “Her’s Law”, named after He Tingbo by peers and her colleagues, which could be further applied in smartphones and AI computing as elaborated by Huawei. By 2031, the high-end chips Huawei designs based on the τ Scaling Law are expected to feature a transistor density that is equivalent to 14 Å (1.4 nm) processes. [TechNode reporting]